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The original content of this DCR is modified as follows based on the contents of the final revision of ESCC 9000 (Draft 7E; see attached) as effectively approved by the PSWG during meeting #69 on 24/06/2015:
Note: 9000 draft 7E is the same as draft 7D (as reviewed and approved by the PSWG) with one addition per item 12) below as agreed with the PSWG during meeting #69.
Note: the item numbers given below refer to the same item numbers in the original DCR855
3) This Item and all changes to add Radiographic Inspection to Screening Tests are removed from the DCR
4) The new definitions are amended to be as follows (based on definitions in MIL-PRF-38535 as modified by the PSWG):
• Integrated Circuit (Microcircuit): A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements on or within a single substrate to perform an electronic circuit function. Monolithic Microcircuits and Multichip Microcircuits are considered as Integrated Circuits.
• Monolithic Microcircuit: A microcircuit consisting exclusively of elements formed in situ on or within a single semiconductor substrate with at least one of the elements formed within the substrate (with a single semiconductor die).
• Multichip Microcircuit: A microcircuit consisting of two or more semiconductor dice coming from the same manufacturer, from one or more foundries, individually attached to a single package cavity.
The following new items are added to DCR855:
12) Para 5.3, 6.1, 7.1.1; Add the following clarification subpara:
For Monolithic Microcircuits, tests and inspections shall be performed at Monolithic Microcircuit level. For Multichip Microcircuits, tests and inspections shall be performed at Multichip Microcircuit level.
13) Para 5.3.2; Add the following subpara:
For Multichip Microcircuits, testing shall be performed on each semiconductor die incorporated into the component.
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