For ESCC 9000 issue 11:
See attached Draft 12C with highlighted changes:
• Green highlights: per PSWG conclusion
• Blue highlights: minor additional editorial changes
• Yellow highlight are the original DCR changes
PSWG change details:
Para. 3 modify the definitions of:
• Wire bonded Integrated Circuit
• Flip-Chip Integrated Circuit
Paras. 3, 4.6, 5.1.1, 5.3.2, 8.4(c), Chart F2A, Chart F3A, Chart F4A
Redefine Add-on Components to be applicable to both Wire bonded Integrated Circuits and Flip-Chip Integrated Circuits
……..
For ESCC 2269000 issue 7:
See attached Draft 8C with highlighted changes:
• Green highlights: per PSWG conclusion
• Yellow highlight are the original DCR changes
PSWG change details:
Para. 3 modify the definitions of:
• Wire bonded Integrated Circuit
• Flip-Chip Integrated Circuit
• Add-on Components
Para. 8.3.5.3.1: add Constant Acceleration test (after Vibration) as specified in ESCC9000 Chart F4A.
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