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DCR1621 Modifications: For ESCC 9030 issue 2: See attached Draft 3B with highlighted changes: • Green highlights: per PSWG conclusion • Blue highlights: minor additional editorial changes (including changes to the DCR original contents) • Yellow highlight are the original DCR changes
PSWG change details: Para. 3 modify the definitions of: • Wire bonded Integrated Circuit • Flip-Chip Integrated Circuit
…….. For ESCC 2269000 issue 2: See attached Draft 3B with highlighted changes: • Green highlights: per PSWG conclusion • Blue highlights: minor additional editorial changes (including changes to the DCR original contents)
PSWG change details: Para. 3 modify the definitions of: • Wire bonded Integrated Circuit • Flip-Chip Integrated Circuit
Para. 8.3.3.x: delete the sample sizes from the titles.
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