Component Details HP07-20

Component

EPPL Part: 2
Part Type: HP07-20
Group: MICROCIRCUITS Subgroup: MICROWAVE MONOLITIC INTEGRATED CIRCUITS (MMIC)
Package:
Description:
MMIC, GaAs Foundry Process, MESFET 0.7 um for power applications up to Ku Band.
Replacement of HP07 Process by HP07-20 process due to a change in the gate lithography process.

ESCC Specifications:
Other Specifications:
Manufacturer:
UMS
Bât Charmille - Parc Silic de Villebon - Courtaboeuf, 10 avenue du Québec
91140 Villebon-sur-Yvette
France

Ref. number:
 PDF
Approval Status
Qualification:
Others
Other:
Highest screening level (MIL):
Evaluation programmes or other approvals:
Former space usage:
Previous Procurement and Test Data
Test data (Evaluation, Lot acceptance, DPA, MIL QCI/TCI, ...):
Radiation Hardness Data
Total Dose Effects:
Displacement damage:
Single event effects (SEL/SEU/SET/SEFI/SEB/SEGR/others):
Remarks
DO NOT USE BEYOND Vgdmax/2 DUE TO SENSITIVITY TO HEAVY IONS.

Optimized for:

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