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The changes per this DCR are replaced by the following:
For ESCC 5203/010:
The following deviation shall be added to Appendix A, AGREED DEVIATIONS FOR STMICROELECTRONICS (F)
ITEMS AFFECTED:
Para. 2.9.2, Power Burn-in Conditions (TO-257 and SMD.5)
DESCRIPTION OF DEVIATIONS:
For TO-257 and SMD.5 packaged Variants 04 to 07, the following alternate Power Burn-in conditions may be applied:
· Ambient Temperature (Tamb): +20 to +50degC (Note 1)
· Power Dissipation (Ptot): As per Maximum Ratings. Derate Ptot1 at the chosen Tamb using the specified Rth(j-a) (W)
· Collector-Base Voltage (VCB): 20 to 40V
· Note 1: No heat sink nor forced air directly on the device shall be permitted.
For ESCC 5204/002:
The following deviation shall be added to Appendix A, AGREED DEVIATIONS FOR STMICROELECTRONICS (F)
ITEMS AFFECTED:
Para. 2.9.2, Power Burn-in Conditions (TO-257 and SMD.5)
DESCRIPTION OF DEVIATIONS:
For TO-257 and SMD.5 packaged Variants 04 to 07, the following alternate Power Burn-in conditions may be applied:
· Ambient Temperature (Tamb): +20 to +50degC (Note 1)
· Power Dissipation (Ptot): As per Maximum Ratings. Derate Ptot1 at the chosen Tamb using the specified Rth(j-a) (W)
· Collector-Base Voltage (VCB): -20 to -40V
· Note 1: No heat sink nor forced air directly on the device shall be permitted.
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