The original Proposed Wording of Change detailing the content of the new appendix for Souriau in 3401/001 & 3401/081 shall be replaced by the following:
Add new appendix:
AGREED DEVIATIONS FOR SOURIAU (F)
3401/001:
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Items Affected
Para. 4.2.2, Deviations from Final Production Tests (Chart II)
Description of Deviations
Para. 9.1.4, Electrical Measurements at Room Temperature:
For solder bucket, PCB and wire-wrap contacts, Low Level Contact Resistance and Rated Current Contact Resistance measurements, performed in accordance with Table 2 of the Detail Specification, may be omitted provided that Low Level Contact Resistance measurements are performed on 10 contacts per contact batch, in accordance with the Souriau PID requirements. The results of the Low Level Contact Resistance measurements shall be considered for PDA.
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3401/081:
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Items Affected
Para. 4.2.2, Deviations from Final Production Tests (Chart II(b))
Description of Deviations
Para. 9.1.4, Electrical Measurements at Room Temperature:
For all contacts, Low Level Contact Resistance and Rated Current Contact Resistance measurements, performed in accordance with Table 2 of the Detail Specification, may be omitted provided that Low Level Contact Resistance measurements are performed on 10 contacts per contact batch, in accordance with the Souriau PID requirements. The results of the Low Level Contact Resistance measurements shall be considered for PDA.
Justification
SOURIAU justifies its request to carry out only the low level contact resistance test on a sampling of 10 parts per batch for the final production tests because for each manufacturing batch of contacts we have:
- CofC of raw material
- a test report of plating with thickness measurements, plating porosity test and adherence test .
- dimensional check
- crimping capability test
- for socket contacts “Contact Capability test at 100%”
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