Proposed text for modified version of DCR410 on 4001/023 Issue 3 to fully replace the original DCR contents:
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Paragraphs and Pages Affected
Specification 4001/023 issue 3 is re-written as issue 4 to incorporate changes, resulting from the proposed modification of 4001 issue 1 (per currently pending DCR409) including implementation of Failure Rate Level requirements, as summarised herein (see Attached for proposed issue 4 Draft H).
The layout, format and general content of the proposed 4001/023 issue 4 is based closely on the re-written ESCC Detail Specifications under current ESCC 9000 issue 4. The technical content of the proposed ESCC 4001/023 issue 4 remains closely based on the original ESCC 4001/023 issue 3.
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Other Documents Affected N/A
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Proposed Wording of Change
Total reformat of this Detail Specification (from the range of various ESCC Detail Specifications, 4001/xxx, for resistors under Generic Specification No. 4001) as part of the ongoing conversion to the ESCC format.
In addition the specification is amended to include the requirements applicable to the specification of a Failure Rate Level for components consistent with the proposed new generic 4001 issue 2 and new ESCC Basic Specification No. 94 - FAILURE RATE LEVEL SAMPLING PLANS AND PROCEDURES, as proposed for implementation into the ESCC system by pending DCR409. Currently as advised by Vishay/F only new Variants 09 to 12 are planned to be available with an approved failure rate level (as is specified in the Vishay/F Appendix).
See below for summary of changes, also see attached proposed Issue 4 Draft H.
Note: known support for active procurement against this specification includes the following Manufacturer:
Vishay SA Sfernice/France (ESCC QPL listed with qualified Variants 01, 02, 03 plus willing to support procurement of all other variants)
Summary of changes to the current format, layout and content is as follows:
1. Rewording and restructure of various sections and paragraphs of the specification, plus other editorial changes based on the layout and editorial content of other Detail Specifications already converted to ESCC format.
2. Addition of the Failure Rate Level Letter to the definition of the ESCC Component Number (in para. 1.4.1)
3. Addition of new Variants 09 to 12 (in para 1.4.2)
4. Addition of notes that state Variants 05 to 08 are not suitable for solder assembly methods (i.e. Solderability testing is not applicable to Variants 05 to 08)(in paras 1.4.2 Note 6, 1.5 Note 4, 2.1.1.2, 2.7 Note 1).
5. Clarification that, for components with a specified temperature coefficient of TC=+/-5ppm/C, a TC=+/-10ppm/C applies over the full operating temperature range (in para 1.4.2 Note 4).
6. In the Maximum Ratings table amend "Insulation Voltage" to be "Isolation Voltage" (to be consistent with ESCC4001 & ESCC2134000)(in para 1.5)
7. Figure 1 Parameter Derating Requirements moved to be a note to the Maximum Ratings table (in para 1.5).
8. Para. 4.4.1 Case, clarified to refer to the "resistive element" rather than "Alumina substrate" (in para 1.7.1).
9. New para 2.5 for Resistance to Soldering Heat test is added.
10. Insulation Resistance test is added to Table 2 but is guaranteed but not tested during screening (in para 2.6.1).
11. Para 4.6.2 & Table 3. High & Low Temp Electrical's: change the applied sampling to be a fixed sample of 5 mounted components from the total production lot (to be consistent with new proposed generic 4001 issue 2)(in para 2.6.2).
12. Table 3 (new para 2.6.2)
TC limits for 5ppm/C components added to Table 3 for temp ranges -55C to +155C.
TC limits for 5ppm/C components for temp range +22C to +70C corrected to be +/- 0.026%
13. Table 4 is deleted.
14. Figure 5 is deleted.
15. Table 6, Delete drying "Procedure I" reference from Solderability & Resistance to Soldering Heat (to be consistent with ESCC 4001)(in para 2.7).
16. Table 6. 8000hour test references added to Operating Life applicable to Failure Rate Endurance Testing only (in para 2.7)
17. Vishay/F Appendix
The following deviations are added to the Vishay/F appendix:
- Dimension Check (screening level test) specified as guaranteed but not tested.
- Permanence of Marking (Qual level test) specified as guaranteed but not tested.
- Burn-in during Screening is not applicable for Failure Rate Level specified versions of Variants 09 to 12. For these components Burn-in is effectively replaced by Overload with a GONOGO measurement of change in resistance.
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Justification (see also change details for each item above):
1, 6, 7, 9, 10, 11, 13, 14, 15; Part of the ongoing activity of conversion of ESA/SCC specifications to the ESCC format. Amendments are made to the format and presentation to be consistent with the various other ESCC Detail Specifications, already converted to ESCC format, as well as the proposed ESCC Generic Specification No. 4001 issue 2 (per DCR409)
2, 3, 16, 17; Implementation of Failure Rate Level as requested by Vishay/F to be consistent with DCR409 on ESCC4001 issue 1 and new ESCC Basic Specification No. 94.
17; As requested by Manufacturer Vishay/F.
4, 5, 8; Clarification provided by Vishay/F & CNES.
12; Minor amendments to make the testing consistent with the specified requirements.
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Justification:
as above
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