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- Changes apply to the current issue of ESCC 2269000, i.e. Issue 6 dated
February 2018. The proposed change to page 17 Para. 8.3.5.3.2 (Thermal
Vacuum Test) has already been implemented in ESCC 2269000 Issue 6.
- The proposed change to page 15 Para. 8.3.4.7 has been rejected by the
PSWG, as stated in the PSWG Chairman's Disposition of this DCR. This change
shall therefore not be included in ESCC 2269000 Issue 7.
- Proposed wording (page 16 Para. 8.3.5.2.1 "(i) Temperature Cycling") is
amended to "All devices shall be subjected to the test defined in Chart F3A
of ESCC Generic Specification No. 9000 except that, for wire-bonded
components the number of cycles shall be 100 minimum, and for flip-chip
components the number of cycles shall be 1500 minimum."
- Proposed wording (page 8 Para 3 "Add-on Components") is amended as
follows: "Capacitors and/or resistors mounted in and electrically connected
to a flip-chip integrated circuit assembly. Other component types are not
permitted."
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