|
|
|
|
|
|
|
|
|
|
|
|
Replace original contents of this DCR by the following:
Replace in Para. 8.3 the 5th subpara ("The ETP shall include a DPA …") by the following:
The ETP shall include a constructional analysis of components representative of all the materials and constructional techniques employed.
The ETP shall also include an assessment of the component capability to withstand typical mounting in accordance with ECSS-Q-ST-70-08 and/or ECSS‑Q‑ST‑70-38. Where specific mounting conditions resulting in a critical mounting behavior are identified, the Manufacturer and the EA are entitled to set-up an adequate procedure to closely simulate the behaviour of components mounted on printed circuit boards. This may include the participation of users but these tests do not replace the mandatory users’ validation of their mounting processes as per project requirements and ECSS-Q-ST-70-08 and/or ECSS-Q-ST-70-38 recommendations.
In addition:
Para. 3 & 8.3, correct ECSS-Q-ST-60 (was ECSS-Q-60)
Para. 3, add ESCC 21700 General Requirements for the Marking of ESCC Components
Para. 3.2, add ECSS-Q-ST-70-08, ECSS-Q-ST-70-38 & ECSS-Q-ST-70-02.
i.e. add the following:
ECSS-Q-ST-70-02 Space product assurance: Thermal vacuum outgassing test for the screening of space materials
ECSS-Q-ST-70-08 Space product assurance: Manual soldering of high-reliability electrical connections
ECSS-Q-ST-70-38 Space product assurance: High-reliability soldering for surface-mount and mixed technology
|
|
|
Login
