The following specific additional amendments also apply to this DCR:
22) Table 1(b) Maximum Ratings, Operating Temperature Range Characteristic: The remark "Tamb" is changed to "TS" in order to be consistent with other Maximum Ratings.
23) Para. 1.7 Handling Precautions: Last sentence amended (addition of the standard phrase "per ESCC Basic Specification No. 23800").
24) Table 5(a) Conditions for High Temperature Reverse Bias Burn-in: Characteristic (and Symbol) "Case Temperature, Tcase" replaced by the more appropriate "Soldering Point Temperature, TS".
25) Table 5(b) Conditions for Power Burn-in and Operating Life Tests: Characteristic (and Symbol) "Ambient Temperature, Tamb" replaced by the more appropriate "Soldering Point Temperature, TS". Ambient
Temperature Conditions are replaced with the applicable minimum Soldering Point Temperatures. Power Dissipation Conditions are replaced with the appropriate test condition, i.e. "< or = Ptot given in
Maximum Ratings". Because of the changes above, the wording of Note 1 is simplified (components are no longer required to be clamped within the Burn-in fixture).
26) Appendix A (for Infineon): Deviation on Para. 8.2.3(e), witnessing of Electrical Measurements at Room Temperature, is amended to include 1MHz Parameters in addition to DC Parameters
(q.v. 5611/009 Iss. 2 et al.).
These additional amendments are included in the attached proposed updated specification 5611/006 Issue 6E.
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